ZL-9014B Touch Screen Interlayer Peel Strength Testing Machine

The microcomputer interlayer bonding strength meter is mainly used to measure the internal bonding strength of paper and cardboard. It is suitable for single-layer and multi-layer paper and cardboard, including coated paper and paper and cardboard whose surface is covered with a synthetic polymer film. It is available

Paper and board mills conduct tests regarding the bond strength within the paper. Not suitable for low basis weight, porous, soft or low density paper and board. Interlayer bonding strength refers to the ability of paper and cardboard to resist interlayer separation. It is a reflection of the internal bonding ability of paper and cardboard. The internal bonding strength can be fully controlled, which is very important for processing multi-layer paper and cardboard. If the internal bonding Low values or uneven distribution can cause problems when paper and cardboard are laid flat in offset presses using sticky inks; if the bond strength value is too high, it will make processing difficult and increase the company’s costs. . This test is widely used in multi-layer cardboard such as boxboard, white cardboard, gray cardboard, white cardboard, etc. in the printing and packaging industry.