Microcomputer interlayer bonding strength meter is a special testing equipment specially used to detect the degree of adhesion between layers of multi-layer composite sheet materials. It is most widely used in the papermaking and packaging industry. For example, the interlayer bonding of yarn tube base paper, the interlayer bonding of white board paper, the interlayer bonding of kraft paper, the interlayer bonding of boxboard paper, aluminum foil paper composite packaging materials, etc.
Meet the Standards:
GB/T 26203-2010 “Determination of internal bonding strength of paper and cardboard” (Scott type)
TAPPI T569pm-00 《Internal bond strength (Scott type)》
TAPPI T833pm-94
Technical Parameters:
|
Sample Size |
25.4*25.4mm |
|
Sample Clamping Force |
0~400N (adjustable) |
|
Impact Angle |
90° |
|
Resolution |
0.001lbf/in2 |
|
Release Method |
Manual release and automatic release. |
|
Measuring Range |
A level (10-500) J/M2 B level (500~1000) J/M2 |
|
Indication Error |
A level ±1J/M2 B/C level ±2J/M2 |
|
Unit |
J/M2, lbf/in2 exchange |
|
Human-Machine Interface |
3.0 in LCD display |
|
Data Printing |
Modular integrated thermal printer |
|
Software |
You can choose computer connection software, office document processing, terminal A4 printing |
|
Volume |
500m×400cm×650mm |
|
Environmental Conditions |
Temperature(0~35)℃,Humidity <85% |
|
Weight |
70KG |
|
Working Environment |
Temperature (20±10)℃, Humidity <85% |
© Dongguan Zhongli Instrument Technology Co., Ltd.
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